5-6123675-9 datasheet
Скачать datasheet 04023J0R3ABSTR.pdf Файл формата Pdf (20 страниц, 397,88 kb)
О ДАТАШИТЕ
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Маркировка5-6123675-9
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ПроизводительTE Connectivity
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ОписаниеTE Connectivity 5-6123675-9 Board-to-board Stack Height (mm [in]): 4.00 [0.157] Centerline (mm [in]): 0.50 [0.0197] Connector Style: Receptacle Contact Base Material: Copper Alloy Contact Layout: In-Line Contact Plating, Mating Area, Material: Gold (8) Family Name: Free Height Grounding Contact: With Grounding Plate: Without Industry Application: MFP/LBP, Inkjet, Standard Keyed: Yes Lead Free Solder Processes: Reflow solder capable to 245?°C Locating Post(s): With Number Of Positions: 240 Packaging Method: Tape Pcb Mounting Orientation: Vertical Region: Americas Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Sealant: With Type: COM Express Vacuum Cover: With
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Количество страниц5 шт.
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Форматы файлаHTML, PDF
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